Semiconductor Thin Film Deposition Equipment Producers and Semiconductor Thin Film Deposition Equipment Market Trend

Thin film deposition refers to the deposition of specific materials on a substrate to form thin films with special properties in optics and electricity. Thin film deposition equipment is usually used to deposit film layers of materials such as conductors, insulators, or semiconductors on substrates to give them certain special properties, and is widely used in the manufacturing process of photovoltaics and semiconductors. Thin film deposition equipment can be divided into physical vapor deposition (PVD) equipment, chemical vapor deposition (CVD) equipment, and atomic layer deposition (ALD) equipment, depending on the process principle.

The global semiconductor thin film deposition equipment market size was USD 12.6 billion in 2017, growing to USD 22.1 billion in 2022, with a CAGR of 11.9% from 2017 to 2022. With the rapid rise of the new generation of smartphones, the Internet of Things, artificial intelligence, 5G communications, and other industries, the semiconductor industry has a promising market outlook. The global semiconductor thin film deposition equipment market is expected to grow to USD 38.5 billion in 2027, with a CAGR of 11.7% from 2022 to 2027.

Figure 2017-2027 Global Semiconductor Thin Film Deposition Equipment Market Size (Billion USD) and CAGR
The top five manufacturers in the semiconductor thin film deposition equipment industry are Applied Materials (AMAT), Lam Research Service Co. (Lam), Tokyo Electron (TEL), Hitachi High-Technologies, and ASM International (ASM).